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RF and Microwave Microelectronics Packaging II 1st ed. 2017 edition
RF and Microwave Microelectronics Packaging II
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
172 pages, 50 black & white illustrations, 77 colour illustrations, 130 colour tables, biography
| Médias | Livres Hardcover Book (Livre avec dos et couverture rigide) |
| Validé | 22 mars 2017 |
| ISBN13 | 9783319516967 |
| Éditeurs | Springer International Publishing AG |
| Pages | 172 |
| Dimensions | 155 × 235 × 13 mm · 439 g |
| Langue et grammaire | Français |
| Éditeur | Kuang, Ken |
| Éditeur | Sturdivant, Rick |