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RF and Microwave Microelectronics Packaging Ken Kuang 2010 edition
RF and Microwave Microelectronics Packaging
Ken Kuang
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.
285 pages, 15 black & white tables, biography
| Médias | Livres Paperback Book (Livre avec couverture souple et dos collé) |
| Validé | 5 septembre 2014 |
| ISBN13 | 9781489983244 |
| Éditeurs | Springer-Verlag New York Inc. |
| Pages | 285 |
| Dimensions | 155 × 235 × 16 mm · 426 g |
| Langue et grammaire | Anglais |
| Éditeur | Cahill, Sean S. |
| Éditeur | Kim, Franklin |
| Éditeur | Kuang, Ken |