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Physical Design for Multichip Modules - the Springer International Series in Engineering and Computer Science 1994 edition
Mysore Sriram
Physical Design for Multichip Modules - the Springer International Series in Engineering and Computer Science 1994 edition
Mysore Sriram
Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to interconnect analysis. It also discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance.
197 pages, biography
Médias | Livres Hardcover Book (Livre avec dos et couverture rigide) |
Validé | 31 mars 1994 |
ISBN13 | 9780792394501 |
Éditeurs | Kluwer Academic Publishers |
Pages | 197 |
Dimensions | 156 × 234 × 14 mm · 449 g |
Langue et grammaire | English |
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