![Rapid Thermal Processing for Future Semiconductor Devices - Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan) - Livres - Elsevier Science & Technology - 9780444513397 - 2 avril 2003](https://imusic.b-cdn.net/images/item/original/397/9780444513397.jpg?fukuda-h-muroran-institute-of-technology-department-of-electrical-and-electronic-engineering-mizumoto-cho-muroran-hokkaido-japan-2003-rapid-thermal-processing-for-future-semiconductor-devices-paperback-book&class=scaled&v=1582758880)
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Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan)
Rapid Thermal Processing for Future Semiconductor Devices
Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan)
A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe and hetero-structure.
160 pages
Médias | Livres Paperback Book (Livre avec couverture souple et dos collé) |
Validé | 2 avril 2003 |
ISBN13 | 9780444513397 |
Éditeurs | Elsevier Science & Technology |
Pages | 160 |
Dimensions | 172 × 243 × 17 mm · 310 g |