Communiqués par John Lau

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Cover for John Lau · Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration (Hardcover Book) (2026)

Cu-Interconnects, Glass, and AI-... (2026)

Cover for John Lau · Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (Hardcover Book) (2025)

Hybrid Bonding, Advanced Substra... (2025)

Cover for John Lau · 3D IC Integration and Packaging (Hardcover Book) [Ed edition] (2015)

3D IC Integration and Packaging (2015)

Cover for John Lau · Through-Silicon Vias for 3D Integration (Hardcover Book) [Ed edition] (2012)

Through-Silicon Vias for 3D Inte... (2012)

Cover for John Lau · Thermal Stress and Strain in Microelectronics Packaging (Paperback Book) [Softcover reprint of the original 1st ed. 1993 edition] (2012)

Softcover reprint of the original 1st ed. 1993 edition

Thermal Stress and Strain in Mic... (2012)

Cover for John Lau · Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Hardcover Book) [Ed edition] (2010)

Reliability of RoHS-Compliant 2D... (2010)