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Communiqués par B Keser

29 mars 2019 – 4 janvier 2022

Cover for B Keser · Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package - IEEE Press (Hardcover Book) (2022)

Embedded and Fan-Out Wafer and P... (2022)

Cover for B Keser · Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press (Hardcover Book) (2019)

Advances in Embedded and Fan-Out... (2019)